At the Qualcomm Technology and Cooperation Summit on May 21，Honor CEO Zhao Ming announced，榮耀HONOR 50系列將全球首發搭載驍龍778G移動平台，subsequently，有博主曬出了該機的真機照。From the photo，The back of the machine uses the AG process of star asteroid diamond，Double ring、Runway-type triple camera module，It may be a combination of ultra-large bottom main camera + ultra-wide angle + periscope telephoto lens。
According to previous revelations，HONOR 50系列除了擁有最新流出的類似土豪金的顏色外，There are also many colors such as Jifenglan and Sakura Pink。Appearance，Honor 50 series rear camera ID design borrows from the design of the world-renowned brand Cartier ring，This is also consistent with Honor's design philosophy that always pursues fashionable appearance。core performance，According to previous reports，Honor 50 and Honor 50 Pro will be equipped with Snapdragon 778G chip，Pro+ is expected to be equipped with Snapdragon 888 flagship chip。
According to reports，驍龍778G採用6nm工藝打造，Kryo670 CPU整體性能提升40%，Adreno642L GPU的圖形渲染速度較前代平台提升40%。Not only that，驍龍778G支持全新的第六代高通AI引擎，包括高通Hexagon 770處理器，可帶來高達12TOPS的算力。
in addition，在高通發布會後，趙明談到了未來的產品規劃，稱新款榮耀Magic發佈時，會採用最頂級的驍龍芯片。雖然趙明並未透露具體情況，但隸屬於驍龍8系列基本已是板上釘釘，除驍龍888之外，高通今年還會有驍龍888 Pro（名字尚不確定）。
before，有博主爆料，目前有國內廠商正在測試高通驍龍888 Pro芯片，新機有望在今年第三季度上市。根據該博主最新消息來看，榮耀將是推出搭載驍龍888 Pro新機的廠商之一，並且榮耀很有可能會搶到首發，而且據說打磨得很好。
趙明曾表示，榮耀Magic系列和榮耀數字系列將超越華為Mate和P系列的硬件設計和體驗，將擁有標誌性的外觀設計、超前的影像能力和算法、業界第一的通信能力、極致系統設計能力、嚴苛的製造工藝和質量保障等。
source：Fast technology
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