Xiaomi 11 Pro heat dissipation：The performance is still the best in solid-liquid gas three-state three-dimensional heat dissipation multi-wheel test
In order to fully utilize the performance of Snapdragon 888，The heat dissipation of Xiaomi 11 Pro has also been greatly upgraded。Except for the previous VC liquid cooling、graphite、External graphene，This time, a new thermal conductivity material, phase change heat dissipation pad, was also added，Directly cover the core heating area，It gradually liquefies when absorbing heat，Fully conduct heat to liquid-cooled VC plate，Subsequently vaporizes the thermally conductive material in liquid-cooled VC，After flowing to the cold end, liquefies and releases heat to complete heat conduction。
In the new heat dissipation design，The most important improvement is in the core SOC part，Addition of phase-change silicone grease，It can better conduct heat generated rapidly during high load operation of SOC，efficient、Quickly conduct heat to the cold end，This ensures that the core temperature will not have too much impact on performance。
To test the effect of new heat dissipation，We performed three rounds of testing using GFXbench with the largest load，Let's see how the heat dissipates。In three rounds of tests，The core temperature reached the highest 60℃ in the last round，However, after the heavy load is over，The temperature will drop rapidly，It shows that the thermal conductivity efficiency of Xiaomi 11 Pro is still very high。
After three rounds of GFXbench cycle test，Because of fever，The score of Xiaomi 11 Pro has indeed dropped to a certain extent，The maximum amplitude can reach about 10%。
but，even so，Comparing the performance of Xiaomi 11 Pro when it is overheated with a Snapdragon 888 flagship that is famous for its conservative scheduling and not heating up in the past tests，Xiaomi 11 Pro's worst third-round score is still slightly better than the flagship's performance after the frequency reduction in the second half of the single-round score.。This is enough to show the power of Xiaomi 11 Pro in performance release，Strong heat dissipation configuration，Under this severe test，It can stand for three rounds without falling。
After three consecutive rounds of tests，We also looked at the heat on the back of the phone.。Excellent heat dissipation means timely exporting of heat，Therefore, the temperature on the back is also conceivable。The hottest part is concentrated in the upper half，Both the front and back temperatures have reached about 48℃。
therefore，Although the heat dissipation is excellent，But in full load，The temperature on the surface of Xiaomi 11 Pro is also not low。If you want to play games like "Genshin Impact" that require high performance requirements，It is recommended to use an ice-sealed heat-sinking back clip，And try to install it in a position that is upright，To achieve cooling and auxiliary heat dissipation effects。